Types of Field Effect Transistor: In general, Three Types of Field Effect Transistor are namely, Junction field effect transistor (JFET) Metal oxide semiconductor field effect transistor (MOSFET) Complementary Metal Oxide Semiconductor (CMOS) Junction field effect…
Parallel Plate Capacitor in IC Fabrication: The Parallel Plate Capacitor in IC Fabrication structures are as shown in the Fig. 1.24. In most widely used parallel plate capacitor type shown in Fig. 1.24 (a), the…
Integrated Resistor: In Integrated Resistor circuit design, the importance is given to the maximum usage of transistors. For example digital CMOS, nMOS and GaAs circuits are fabricated entirely with transistors and diodes. The Integrated Resistor…
Monolithic Diodes: Monolithic Diodes - The fabrication of diode is very straight forward. Generally any two terminals of the transistor are connected together to form one of the electrodes while the remaining terminal can be…
Fabrication of PNP Transistor in Integrated Circuit: There are different ways of Fabrication of PNP Transistor in Integrated Circuit. The important means of integrating PNP Transistor are Vertical PNP transistor, Lateral PNP transistor and Triple…
Fabrication of Monolithic IC: The cross-sectional view of an Fabrication of Monolithic IC and discrete planar transistor are as shown in the Fig. 1.17 (a) and (b) respectively. The main difference between Fabrication of Monolithic…
IC Packaging Process | IC Package Types: After completing all the fabrication processes, several chips are ready on a wafer. Each of the chip is nothing but a complete circuit. Now the next step is…
Metallization Process | Types of Metallization | Applications: Metallization Process in which a thin layer of metal is formed which is used to make interconnections between the components on the chip as well as interconnections…
Ion Implantation Process in IC Fabrication: As we know, the conductivity of the semiconductor increases when small impurity is added to it. The process of adding impurity is called doping while the impurity to be…
Diffusion Process in IC Fabrication: Diffusion is the oldest technique used to add impurity into the Substrate. The main aim of the Diffusion Process in IC Fabrication is to change  the Conductivity of silicon substrate over…
