IC Packaging Process | IC Package Types: After completing all the fabrication processes, several chips are ready on a wafer. Each of the chip is nothing but a complete circuit. Now the next step is…
Metallization Process | Types of Metallization | Applications: Metallization Process in which a thin layer of metal is formed which is used to make interconnections between the components on the chip as well as interconnections…
Ion Implantation Process in IC Fabrication: As we know, the conductivity of the semiconductor increases when small impurity is added to it. The process of adding impurity is called doping while the impurity to be…
Diffusion Process in IC Fabrication: Diffusion is the oldest technique used to add impurity into the Substrate. The main aim of the Diffusion Process in IC Fabrication is to change the Conductivity of silicon substrate over…
Reactive Plasma Etching: The reactive plasma is the discharge in which gases ionized producing chemically active species, oxidizers, reagents. The plasma is reactive in both gaseous and solid phase, hence the name is Reactive Plasma.…
Lithography Process in IC Fabrication: Lithography Process is used to produce a multiple image on the resists which covers the wafer. A Lithography Process in IC Fabrication can be realised with the help of three…
Oxidation in IC Fabrication: Oxidation in IC Fabrication is very important process. In one line, oxidation can be explained as the production of SiO2 using the thermal growth technique. Some of the important uses of…
Molecular Beam Epitaxy Process: The molecular beam epitaxy (MBE) is based on evaporation. In MBE, the film is evaporated and deposited one layer at a time. In the process, no chemical reactions are considered. Instead…
Vapour Phase Epitaxy Process: In chemical vapour deposition (CVD), the film is formed on the surface of the substrate by thermal decomposition and or the reaction of various gaseous compounds. As in CVD, the epitaxial…
Basic Planar Process in IC Fabrication: The Basic Planar Process in IC Fabrication are as listed below. Crystal growth and wafer preparation, Epitaxial growth, Oxidation, Lithography, Reactive plasma etching, Diffusion, Ion implantation, Metallization, Assembly techniques…
