IC Fabrication Articles: Diode Fabrication Process and Packaging : Alloy and Diffused Diodes – Two commonly used techniques for Diode Fabrication Process and Packaging are the alloy method and the…
Parallel Plate Capacitor in IC Fabrication: The Parallel Plate Capacitor in IC Fabrication structures are as shown in the Fig. 1.24. In most widely used parallel plate capacitor type shown…
Ion Implantation Process in IC Fabrication: As we know, the conductivity of the semiconductor increases when small impurity is added to it. The process of adding impurity is called doping…
Diffusion Process in IC Fabrication: Diffusion is the oldest technique used to add impurity into the Substrate. The main aim of the Diffusion Process in IC Fabrication is to change the…
Lithography Process in IC Fabrication: Lithography Process is used to produce a multiple image on the resists which covers the wafer. A Lithography Process in IC Fabrication can be realised…
Oxidation in IC Fabrication: Oxidation in IC Fabrication is very important process. In one line, oxidation can be explained as the production of SiO2 using the thermal growth technique. Some…
Basic Planar Process in IC Fabrication: The Basic Planar Process in IC Fabrication are as listed below. Crystal growth and wafer preparation, Epitaxial growth, Oxidation, Lithography, Reactive plasma etching, Diffusion,…
Integrated Circuits Fabrication Process: IC Types - An Integrated Circuits Fabrication Process consists of several interconnected transistors, resistors, etc., all contained in one small package with external connecting terminals. The…