IC Packaging Process

IC Packaging Process | IC Package Types: After completing all the fabrication processes, several chips are ready on a wafer. Each of the chip is nothing but a complete circuit.…

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Diode Fabrication Process and Packaging

Diode Fabrication Process and Packaging: Alloy and Diffused Diodes - Two commonly used techniques for Diode Fabrication Process and Packaging are the alloy method and the diffusion method. To construct…

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IC Operational Amplifiers Articles

IC Operational Amplifiers Articles: Biasing Bipolar Op Amp Circuit : Biasing Bipolar Op Amp Circuit – Like other electronic devices, operational amplifiers must be correctly biased if they are to…

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IC Fabrication Articles

IC Fabrication Articles: Diode Fabrication Process and Packaging : Alloy and Diffused Diodes – Two commonly used techniques for Diode Fabrication Process and Packaging are the alloy method and the…

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Discrete Transistor Packaging

Discrete Transistor Packaging: Discrete Transistor Packaging - Many low-power transistors are encapsuled in resin with protruding metal connecting leads, as illustrated in Fig. 7-24. This is known as a TO-92…

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Microwave Transistors

Microwave Transistors: Silicon bipolar transistors were first on the microwave scene, followed by GaAs field-effect transistors. Indeed, FETs now have noticeably lower noise figures, and in the C band and…

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Fabrication of Integrated Circuits Articles

Fabrication of Integrated Circuits Articles: Basic Planar Processes in IC Fabrication : The Basic Planar Processes in IC Fabrication are as listed below. (1) Crystal growth and wafer preparation,(2)Epitaxial growth,(3)Oxidation,(4)Lithography,(5)Reactive…

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