Category: IC FABRICATION

Integrated Circuit Components

Integrated Circuit Components: The¬†Integrated Circuit Components are namely, Transistors and Diodes: The epitaxial planar diffusion process described already is normally employed for the manufacture of IC transistors and diodes. Collector, base, and emitter regions are diffused into a silicon substrate and surface terminals are provided for connection, as illustrated in Fig. 7-20(a). In discrete transistors […]

Integrated Circuits Fabrication Process

Integrated Circuits Fabrication Process: IC Types – An Integrated Circuits Fabrication Process consists of several interconnected transistors, resistors, etc., all contained in one small package with external connecting terminals. The circuit may be entirely self-contained, requiring only input and output connections and a supply voltage. Alternatively, a few external components may have to be connected […]

Transistor Fabrication Techniques

Transistor Fabrication Techniques: Alloy Transistors – For manufacture of alloy Transistor Fabrication Techniques, single-crystal n-type wafers are scribed into many small sections, or dice, each of which forms the substrate for one transistor. A small pellet of p-type material is melted on one surface of each section until it partially penetrates and forms an alloy […]

Transistor Construction Techniques and Performance

Transistor Construction Techniques and Performance: The following are Transistor Construction Techniques and Performance are as follows, Current Gain: Good current gain requires that most charge carriers from the emitter pass rapidly to the collector. So, there should be little outflow of charge carriers via the base terminal, and there should be few carrier re-combinations within […]

Diode Fabrication Process and Packaging

Diode Fabrication Process and Packaging: Alloy and Diffused Diodes – Two commonly used techniques for Diode Fabrication Process and Packaging are the alloy method and the diffusion method. To construct an alloy diode, a pn-junction is formed by melting a tiny pellet of aluminum (or some other p-type impurity) on the surface of an n-type […]

Processing of Semiconductor Materials

Processing of Semiconductor Materials: Preparation of Silicon and Germanium – Silicon is one of the commonest elements on earth. It occurs as silicon dioxide (SiO2) and as silicates; mixtures of silicon and other materials. Germanium is derived from zinc or copper ores. When converted to bulk metal, silicon and germanium contain large quantities of impurities. […]