IC Fabrication

Integrated Circuit Components

Integrated Circuit Components: The Integrated Circuit Components are namely, Transistors and Diodes: The epitaxial planar diffusion process described already is normally employed for the manufacture of IC transistors and diodes. Collector, base, and emitter regions are diffused into a silicon substrate and surface terminals are provided for connection, as illustrated in Fig. 7-20(a). In discrete transistors […]

Integrated Circuit Components Read More »

Integrated Circuits Fabrication Process

Integrated Circuits Fabrication Process: IC Types – An Integrated Circuits Fabrication Process consists of several interconnected transistors, resistors, etc., all contained in one small package with external connecting terminals. The circuit may be entirely self-contained, requiring only input and output connections and a supply voltage. Alternatively, a few external components may have to be connected

Integrated Circuits Fabrication Process Read More »

Transistor Fabrication Techniques

Transistor Fabrication Techniques: Different Transistor Fabrication Techniques are namely Alloy Transistor Micro Alloy Transistor Microalloy Diffused Transistor Diffuse Mesa Transistor Epitaxial Mesa Transistors Diffused Planar Transistor Annular Transistor 1. Alloy Transistor: For manufacture of alloy Transistor Fabrication Techniques, single-crystal n-type wafers are scribed into many small sections, or dice, each of which forms the substrate

Transistor Fabrication Techniques Read More »

Processing of Semiconductor Materials

Processing of Semiconductor Materials: Preparation of Silicon and Germanium – Silicon is one of the commonest elements on earth. It occurs as silicon dioxide (SiO2) and as silicates; mixtures of silicon and other materials. Germanium is derived from zinc or copper ores. When converted to bulk metal, silicon and germanium contain large quantities of impurities.

Processing of Semiconductor Materials Read More »

Scroll to Top