Tag: Assembly techniques and packaging

Basic Planar Processes in IC Fabrication

Basic Planar Processes in IC Fabrication The Basic Planar Processes in IC Fabrication are as listed below. Crystal growth and wafer preparation Epitaxial growth Oxidation Lithography Reactive plasma etching Diffusion Ion implantation. Metallization. Assembly techniques and packaging Let us study each process in detail one by one. Crystal Growth and Wafer Preparation In this process […]